Compare Intel Xeon W-3345 Ice Lake vs Intel Xeon W-1390 Rocket Lake vs Intel Xeon W-1370 Rocket Lake

[[{"Ft":"Connectivity","Fn":"PCI Express","Fv":"4, 64 lanes"},{"Ft":"Construction","Fn":"Form Factor","Fv":"Workstation microprocessor"},{"Ft":"Construction","Fn":"Lithography","Fv":"10 nm"},{"Ft":"Construction","Fn":"Platform","Fv":"Ice Lake"},{"Ft":"Dimensions","Fn":"Size | Depth","Fv":"56.5 mm"},{"Ft":"Dimensions","Fn":"Size | Width","Fv":"77.5 mm"},{"Ft":"Function","Fn":"Instruction Set","Fv":"Intel® AVX-512"},{"Ft":"Function","Fn":"Processor | Cores","Fv":"24 Cores"},{"Ft":"Function","Fn":"Processor | Threads","Fv":"48 Threads"},{"Ft":"Function","Fn":"Security","Fv":"AES New Instructions, Trusted Execution Technology, Execute Disable Bit, Mode-based Execute Control (MBEC), Virtualization Technology (VT-x), Virtualization Technology for Directed I/O (VT-d), VT-x with Extended Page Tables (EPT), AES New Instructions,..."},{"Ft":"Function","Fn":"Supported Technologies","Fv":"Deep Learning Boost (Intel DL Boost), Speed Shift Technology, Hyper-Threading Technology, Enhanced Intel SpeedStep Technology, Volume Management Device (VMD), Deep Learning Boost (Intel DL Boost), Speed Shift Technology, Transactional Synchronization E..."},{"Ft":"Performance","Fn":"Cache","Fv":"36 MB"},{"Ft":"Performance","Fn":"Frequency","Fv":"Max Turbo: 4.00 GHz | Base: 3.00 GHz"},{"Ft":"Performance","Fn":"Memory | Capacity","Fv":"Supports up to 4 TB"},{"Ft":"Performance","Fn":"Memory | Type","Fv":"DDR4-3200, Max 8 channels, ECC supported"},{"Ft":"Performance","Fn":"Power Consumption","Fv":"250 W"},{"Ft":"Production","Fn":"Debut","Fv":"2021 Q3"},{"Ft":"Production","Fn":"Model Name","Fv":"W-3345"}],[{"Ft":"Connectivity","Fn":"PCI Express","Fv":"4.0, 20 lanes (Up to 1x16+1x4, 2x8+1x4, 1x8+3x4)"},{"Ft":"Construction","Fn":"Form Factor","Fv":"Workstation microprocessor"},{"Ft":"Construction","Fn":"Lithography","Fv":"14 nm"},{"Ft":"Construction","Fn":"Platform","Fv":"Rocket Lake"},{"Ft":"Dimensions","Fn":"Size | Depth","Fv":"37.5 mm"},{"Ft":"Dimensions","Fn":"Size | Width","Fv":"37.5 mm"},{"Ft":"Function","Fn":"Graphics","Fv":"Intel® UHD Graphics P750, 32 execution units, Base 350 MHz, Boost 1.30 GHz, Max 3 displays, DirectX 12.1, OpenGL 4.5, OpenCL 3.0"},{"Ft":"Function","Fn":"Instruction Set","Fv":"64-bit | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2, Intel® AVX-512"},{"Ft":"Function","Fn":"Operating Temperature","Fv":"Max Tjunction 100°C"},{"Ft":"Function","Fn":"Processor | Cores","Fv":"8 Cores"},{"Ft":"Function","Fn":"Processor | Threads","Fv":"16 Threads"},{"Ft":"Function","Fn":"Resolution","Fv":"Max res DP 5120 x 3200 @60Hz / Max res HDMI 4096x2160@60Hz"},{"Ft":"Function","Fn":"Security","Fv":"vPro Platform, AES New Instructions, Secure Key, OS Guard, Trusted Execution Technology, Execute Disable Bit, Boot Guard, Virtualization Technology (VT-x), Virtualization Technology for Directed I/O (VT-d), VT-x with Extended Page Tables (EPT), AES New..."},{"Ft":"Function","Fn":"Supported Technologies","Fv":"Gaussian \u0026amp; Neural Accelerator 2.0, Deep Learning Boost (Intel DL Boost), Optane Memory Supported, Thermal Velocity Boos, Turbo Boost Max Technology 3.0, Hyper-Threading Technology, Enhanced Intel SpeedStep Technology, Thermal Monitoring Technologie..."},{"Ft":"Function","Fn":"Thermal Solution","Fv":"PCG 2019B"},{"Ft":"Function","Fn":"Video","Fv":"Clear Video HD Technology"},{"Ft":"Performance","Fn":"Cache","Fv":"16 MB Intel® Smart Cache"},{"Ft":"Performance","Fn":"Frequency","Fv":"Max Turbo: 5.20 GHz | Base: 2.80 GHz"},{"Ft":"Performance","Fn":"Memory | Capacity","Fv":"Supports up to 128 GB"},{"Ft":"Performance","Fn":"Memory | Type","Fv":"DDR4-3200, Max 2 channels, ECC supported, Max bandwidth 50 GB/s"},{"Ft":"Performance","Fn":"Power Consumption","Fv":"80 W"},{"Ft":"Production","Fn":"Debut","Fv":"2021 Q2"},{"Ft":"Production","Fn":"Model Name","Fv":"W-1390"}],[{"Ft":"Connectivity","Fn":"PCI Express","Fv":"4.0, 20 lanes (Up to 1x16+1x4, 2x8+1x4, 1x8+3x4)"},{"Ft":"Construction","Fn":"Form Factor","Fv":"Workstation microprocessor"},{"Ft":"Construction","Fn":"Lithography","Fv":"14 nm"},{"Ft":"Construction","Fn":"Platform","Fv":"Rocket Lake"},{"Ft":"Dimensions","Fn":"Size | Depth","Fv":"37.5 mm"},{"Ft":"Dimensions","Fn":"Size | Width","Fv":"37.5 mm"},{"Ft":"Function","Fn":"Graphics","Fv":"Intel® UHD Graphics P750, 32 execution units, Base 350 MHz, Boost 1.30 GHz, Max 3 displays, DirectX 12.1, OpenGL 4.5, OpenCL 3.0"},{"Ft":"Function","Fn":"Instruction Set","Fv":"64-bit | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2, Intel® AVX-512"},{"Ft":"Function","Fn":"Operating Temperature","Fv":"Max Tjunction 100°C"},{"Ft":"Function","Fn":"Processor | Cores","Fv":"8 Cores"},{"Ft":"Function","Fn":"Processor | Threads","Fv":"16 Threads"},{"Ft":"Function","Fn":"Resolution","Fv":"Max res DP 5120 x 3200 @60Hz / Max res HDMI 4096x2160@60Hz"},{"Ft":"Function","Fn":"Security","Fv":"vPro Platform, AES New Instructions, Secure Key, OS Guard, Trusted Execution Technology, Execute Disable Bit, Boot Guard, Virtualization Technology (VT-x), Virtualization Technology for Directed I/O (VT-d), VT-x with Extended Page Tables (EPT), AES New..."},{"Ft":"Function","Fn":"Supported Technologies","Fv":"Gaussian \u0026amp; Neural Accelerator 2.0, Deep Learning Boost (Intel DL Boost), Optane Memory Supported, Turbo Boost Max Technology 3.0, Hyper-Threading Technology, Enhanced Intel SpeedStep Technology, Thermal Monitoring Technologies, Deep Learning Boost ..."},{"Ft":"Function","Fn":"Thermal Solution","Fv":"PCG 2019B"},{"Ft":"Function","Fn":"Video","Fv":"Clear Video HD Technology"},{"Ft":"Performance","Fn":"Cache","Fv":"16 MB Intel® Smart Cache"},{"Ft":"Performance","Fn":"Frequency","Fv":"Max Turbo: 5.10 GHz | Base: 2.90 GHz"},{"Ft":"Performance","Fn":"Memory | Capacity","Fv":"Supports up to 128 GB"},{"Ft":"Performance","Fn":"Memory | Type","Fv":"DDR4-3200, Max 2 channels, ECC supported, Max bandwidth 50 GB/s"},{"Ft":"Performance","Fn":"Power Consumption","Fv":"80 W"},{"Ft":"Production","Fn":"Debut","Fv":"2021 Q2"},{"Ft":"Production","Fn":"Model Name","Fv":"W-1370"}]]